发明名称 PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD AND LED MODULE
摘要 <p>[Problem] To provide a laminate which has excellent thermal conductivity, heat resistance, drill workability and flame retardancy. [Solution] A prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, wherein: the thermosetting resin composition contains 80-200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin; the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2-15 µm and (B) magnesium oxide having average particle diameter (D50) of 0.5-15 µm; and the blending ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3-3.</p>
申请公布号 WO2012056703(A1) 申请公布日期 2012.05.03
申请号 WO2011JP06007 申请日期 2011.10.27
申请人 PANASONIC CORPORATION;MATSUDA, TAKASHI;KOMORI, KIYOTAKA;NOZUE, AKIYOSHI;SUZUE, TAKAYUKI;NISHINO, MITSUYOSHI;ASAHI, TOSHIYUKI;TANI, NAOYUKI;KITAGAWA, YOSHITO 发明人 MATSUDA, TAKASHI;KOMORI, KIYOTAKA;NOZUE, AKIYOSHI;SUZUE, TAKAYUKI;NISHINO, MITSUYOSHI;ASAHI, TOSHIYUKI;TANI, NAOYUKI;KITAGAWA, YOSHITO
分类号 C08J5/24;B32B15/08;H05K1/03 主分类号 C08J5/24
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