发明名称 |
Imaging device package, method of manufacturing the imaging device package, and electronic apparatus |
摘要 |
An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an optical member with respect to the substrate; and a bonding section that bonds the supporting body to the substrate while sealing the wire and a bonding terminal of the wire at the peripheral edge of the substrate. |
申请公布号 |
US2012104536(A1) |
申请公布日期 |
2012.05.03 |
申请号 |
US201113317369 |
申请日期 |
2011.10.17 |
申请人 |
SONY CORPORATION |
发明人 |
SEO RYOTARO;ITOH TOHRU;TSUKUDA YUKIHIKO;YAMADA TOMOYASU |
分类号 |
H01L31/0224;H01L31/18 |
主分类号 |
H01L31/0224 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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