发明名称 Dewing prevention structure for substrate
摘要 The application refers to a dewing prevention structure for a substrate (60) accommodated in a housing (10) that has an opening (13) allowing an inflow of outer air. The dewing prevention structure suppresses dew condensation on the substrate (60), wherein a heat conductive member (70) is provided inside the housing (10), and the heat conductive member (70) contacts each of a predetermined heat source (61) inside the housing (10) and an area of the substrate (60) near the opening (13).
申请公布号 EP2448385(A2) 申请公布日期 2012.05.02
申请号 EP20110185425 申请日期 2011.10.17
申请人 AISIN AW CO., LTD. 发明人 MICHIDA, TOSHIFUMI
分类号 H05K5/02 主分类号 H05K5/02
代理机构 代理人
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