| 摘要 |
The invention relates to a process for the uniform electrodeposition of nickel on a copper or copper-coated iron carrier in the presence of polyvinylpyrrolidone as surface active agent, used in the machine building industry. According to the invention, the process consists in preparing some thin compact and uniform passivating films of Ni, by using some Watts-type baths and by using acid solutions based on NiSO6HO - 240g/l and NiCl6HO - 45g/l as buffer system there is used an amount of 30g/l of boric acid and an amount of 5g/l of polyvinylpyrrolidone as a surface active agent, the electrodeposition using a working temperature range of 40...65°C and a current density of 100...300 mA. |
