HEAT-RESISTANT LOW HEAT-CONDUCTIVE FOAM

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant low heat-conductive foam excellent in heat resistance and low heat conductivity.

SOLUTION: This heat-resistant low heat-conductive foam includes a foam having spherical bubbles; has heat conductivity of 0.1 W/m K or lower at 20% compression ratio measured according to ASTM-D5470; preferably has 50% compressive load of 50 N/cm2or lower; preferably has a rate of dimensional change when preserved at 125°C for 22 hours of within ±5%; and has a rate of change of 50% compressive load when preserved at 125°C for 22 hours of within ±10%.

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