| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film-forming composition which has improved solubility of a hole injecting and transporting material and/or an electron accepting compound, has such an adequate drying speed that an uniform coating film can be stably formed, and is suitable for film formation of the hole injecting and transporting layer. <P>SOLUTION: A film-forming composition contains: a hole injecting and transporting material and/or an electron accepting compound; and a liquid dissolving the hole injecting and transporting material and/or the electron accepting compound. The liquid has an aromatic ring and/or an aliphatic ring, and an oxygen atom in a molecule, and mainly contains a solvent having a boiling point of 200°C or higher, or a vapor pressure of 1 torr or less at 25°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
