发明名称 MASKING FILM SUPPORTING BASE
摘要 <P>PROBLEM TO BE SOLVED: To provide a masking film supporting base having excellent characteristics required for a masking film used in partially plating a wiring board, namely excellent punchability in punching a plated part, excellent followability to the surface of a wiring board, low shrinkability in heating and wettability to an adhesive. <P>SOLUTION: The masking film supporting base is obtained by lamination of layers composed of a polybutylene terephthalate and a layer composed of a polyester having a glass transition temperature of 40-90&deg;C by a coextrusion method and has total thickness of 10-50 &mu;m. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012082267(A) 申请公布日期 2012.04.26
申请号 JP20100227759 申请日期 2010.10.07
申请人 OKURA IND CO LTD 发明人 URUSHIBARA TATSUYA;IWAKI YUSUKE;IHARA SEIJI;TSUNO NAOTO
分类号 C09J7/02;B32B27/00;B32B27/36;H05K3/18 主分类号 C09J7/02
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