| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition capable of forming a cured product that excels in transparency, by optimization of temperature and time in a curing condition, as well as excels in light resistance and crack resistance upon a heat cycle test, for example, when used for a sealing material of an optical semiconductor device. <P>SOLUTION: This curable epoxy resin composition includes, as curable components, an alicyclic epoxy compound (A), a curing agent (B) and a curing accelerator (C), wherein a content of the alicyclic epoxy compound (A) is ≥60 wt.% based on the total curable components. The method for producing the cured product includes curing the curable epoxy resin composition on the curing condition of temperature of ≥95°C and ≤135°C, and for ≥4.5 h. <P>COPYRIGHT: (C)2012,JPO&INPIT |
