发明名称 ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a semiconductor device with high electric characteristics is provided. Part of a stacked semiconductor film in which an amorphous semiconductor film is provided on a crystalline semiconductor film is etched using a mixed gas including an HBr gas, a CF4 gas, and an oxygen gas, so that part of the crystalline semiconductor film provided in the stacked semiconductor film is exposed. Etching for forming a back channel portion of a thin film transistor is performed with the method for etching, whereby high electric characteristics can be provided for the thin film transistor.
申请公布号 US2012094445(A1) 申请公布日期 2012.04.19
申请号 US201113273267 申请日期 2011.10.14
申请人 SASAGAWA SHINYA;FUJIKI HIROSHI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 SASAGAWA SHINYA;FUJIKI HIROSHI
分类号 H01L21/336;H01L21/20;H01L21/306 主分类号 H01L21/336
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