| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an underfill agent composition which can form a thin film of large area stably and can impart durable solder connectivity excellent as an underfill agent, and to provide a manufacturing method of a semiconductor device using the composition. <P>SOLUTION: The liquid wafer level underfill agent composition capable of corresponding to B-stage contains (A) epoxy resin, (B) a flux hardener, (C) an imidazole catalyst, (D) a volatile organic solvent, and (E) a porous inorganic filler having a pore volume of 0.3-0.7 cm<SP POS="POST">3</SP>/g and the surface covered with silicon oxide. <P>COPYRIGHT: (C)2012,JPO&INPIT |
