A heat-transferring circuit substrate with limited thermal expansion and method for making same.

摘要

Layers of copper (10) and Invar (12) are cold pressure rolled with reduction in thickness to be metallurgically bonded together in interleaved relation, and strips (20) of the bonded materials are cold pressure rolled together a plurality of times with reduction in thickness to be metallurgically bonded together to form a metal composite (208) and to break up the layers of Invar in the composite, thereby to distribute portions of the Invar material (12.1) in a copper matrix (10.1) to limit thermal expansion of the composite while permitting the matrix to extend in continuous phase along three mutually perpendicular axes through the composite substantially free of diffusion between the copper and Invar materials.