| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cover glass for semiconductor package and its manufacturing method which has a suitable thermal expansion coefficient for plastic package, is capable of precision detection of foreign substances and dust by imaging inspection and shows always a small value in α-ray emission. <P>SOLUTION: This cover glass includes ≤75% SiO<SB POS="POST">2</SB>, 1.1-20% Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, 0-10% B<SB POS="POST">2</SB>O<SB POS="POST">3</SB>, 0.1-20% Na<SB POS="POST">2</SB>O, 0-11% K<SB POS="POST">2</SB>O, and 0-20% alkaline earth metal oxide, in terms of mass%. The mean thermal expansion coefficient is 90-180×10<SP POS="POST">-7</SP>/°C in the temperature range of 30-380°C. Young's modulus is 68 GPa or more. The α-ray emission quantity of the glass is below 0.05 c/cm<SP POS="POST">2</SP>/hr. <P>COPYRIGHT: (C)2012,JPO&INPIT |
