Megasonic cleaning with controlled boundary layer thickness and associated systems and methods

摘要

Megasonic cleaning systems and methods of using megasonic pressure waves to impart cavitation energy proximate a surface of a microelectronic substrate are disclosed herein. In one embodiment, a megasonic cleaning system includes a process tank for containing a liquid, a support element for carrying a substrate submerged in the liquid, and first and second transducers positioned in the tank. The first transducer is further positioned and/or operated to initiate cavitation events in a bulk portion of the liquid proximate a surface of the substrate. The second transducer is further positioned and/or operated to control an interface of fluid friction between the substrate and the bulk portion of the liquid.