发明名称 METHOD OF MANUFACTURING HIGH ELECTRON MOBILITY TRANSISTOR HAVING HIGH POWER USING IMPURITY INJECTION
摘要 PURPOSE: A high power/electron mobility transistor manufacturing method which uses an impurity injection method is provided to reduce a leakage current by increasing electrical resistance of a material layer which includes two-dimensional electron gas. CONSTITUTION: A first material layer is arranged on a substrate(30). The electrical resistance of the first material layer is increased. A source pattern(38S) and a drain pattern(38D) are formed on the first material layer. A gate insulating layer(42) is arranged on the first material layer. A gate electrode, a source electrode(44), and a drain electrode(46) are respectively formed on the gate insulating layer, the source pattern, and the drain pattern.
申请公布号 KR20120035720(A) 申请公布日期 2012.04.16
申请号 KR20100097417 申请日期 2010.10.06
申请人 SAMSUNG ELECTRONICS CO., LTD.;KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION 发明人 CHOI, HYUK SOON;LEE, JUNG HEE;SHIN, JAI KWANG;OH, JAE JOON;HA, JONG BONG;KIM, JONG SEOB;HWANG, IN JUN;HONG, KI HA;IM, KI SIK;KIM, KI WON;KIM, DONG SEOK
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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