LAMINATED STRUCTURE FOR A PRINTED CIRCUIT BOARD BEING PREVENTED THE FORMATION OF CRACK AND MANUFACTURING METHOD THE SAME

摘要

PURPOSE: A method for manufacturing a laminate structure of a printed circuit board and the laminate structure manufactured by the same are provided to prevent a lead crack due to vibration and bending by forming a thin polyimide film with a thickness of 25 um used as a base film. CONSTITUTION: Polyimide is changed to a hydrophilic surface by using a vacuum device. Cu is successively deposited on the surface of a polyimide film with the hydrophilic surface. A tie layer is formed to improve adhesion between polyimide and metal. A Cu layer is formed by electroplating the polyimide with metal.