| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad that is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate. <P>SOLUTION: In the chemical mechanical polishing pad, the aromatic polyamine and the isocyanate terminated prepolymer polyol are provided at an amine moiety to unreacted-NCO moiety stoichiometric ratio of <95%. The light stable polymeric endpoint detection window exhibits a time dependent strain of ≤0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60°C at 100 minutes, and an optical double pass transmission of ≥15% at a wavelength of 380 nm for a window thickness of 1.3 mm. Also, the polishing surface of the chemical mechanical polishing pad is adapted for polishing the substrate selected from the magnetic substrate, the optical substrate and the semiconductor substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
