Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a semiconductor chip within the cavity, such that a backside of the chip is disposed beneath the top surface of the substrate and above a bottom surface of the cavity. The method also includes forming a flexible connecting layer on the top surface of the substrate and extending over the chip. Other embodiments relate to a flexible circuit including a substrate defining a cavity in a top surface thereof. The cavity has encapsulant and a chip disposed therein, wherein a frontside of the chip is substantially coplanar with the top surface of the substrate. A flexible connecting layer is disposed on the top surface of the substrate and is partially supported by the substrate.
申请公布号
WO2012048137(A2)
申请公布日期
2012.04.12
申请号
WO2011US55144
申请日期
2011.10.06
申请人
THE CHARLES STARK DRAPER LABORATORY, INC.;SMITH, BRIAN, R.;CARDOSO, MARIA