发明名称 |
ELECTROLESS PLATING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroless plating method, which can ensure good adhesion between a plating film and a workpiece without using any noble metal such as palladium and without using any harmful chemical such as chromic acid and can permit repeated use of a plating solution. <P>SOLUTION: The electroless plating method includes: a step (1) of applying a polymer containing, as side chains, organic residues having the ability to reduce metallic ions of a plating metal onto the surface of a workpiece; a step (2) of depositing a partially reduced metal oxide of the metal ion on the surface of the workpiece with the applied polymer in a solution containing the metallic ions but not containing a reducing agent capable of reducing the metallic ions; a step (3) of reducing the partially reduced metal oxide into a self-catalytic plating metal in a solution containing a reducing agent capable of reducing the metal ions; and a step (4) of forming a coat of the plating metal on the surface of the workpiece in an electroless plating solution. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012072440(A) |
申请公布日期 |
2012.04.12 |
申请号 |
JP20100218073 |
申请日期 |
2010.09.29 |
申请人 |
TOAGOSEI CO LTD;KANTO GAKUIN UNIV SURFACE ENGINEERING RESEARCH INSTITUTE |
发明人 |
HIRAOKA HIDEKI;KANBE SHINYA;HORIE YOJI;HONMA HIDEO;WATANABE MITSUHIRO;SAITO YUICHI |
分类号 |
C23C18/30;H01L21/288;H05K3/18 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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