| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a joining method which prevents voids from occurring in a resin composition layer, and to provide a semiconductor device, a multilayer circuit board, and an electronic component which are manufactured through the joining method. <P>SOLUTION: In a joining method of this invention, a semiconductor chip 5 having terminals 52 and a circuit board 4 having terminals 44 are arranged so that a surface of the semiconductor chip 5 on which the terminals 52 are mounted faces a surface of the circuit board 4 on which the terminals 44 are mounted. Each terminal 52 is electrically connected to the corresponding terminal 44. Further, the semiconductor chip 5 is bonded to the circuit board 4 so that a first region, in which the terminals 52 of the semiconductor chip 5 are formed, and a second region, in which the terminals 44 of the circuit board 4 are formed, are covered with a resin composition layer 1 provided in the first region. When the terminals 52 electrically connect with the terminals 44, the semiconductor chip 5 is crimped to the circuit board 4 through the resin composition layer 1 under a pressure reduced atmosphere. <P>COPYRIGHT: (C)2012,JPO&INPIT |
