| 摘要 |
Disclosed is a heat treatment apparatus which includes a plurality of first disposing support members having an extendable elastic member to provide a first gap distance between a substrate disposing surface of a heat treatment plate and the rear surface of the substrate; a plurality of second disposing support members providing a second gap distance, which is smaller than the first gap distance, between the substrate disposing surface and the rear surface of the substrate; and a plurality of suction holes disposed at the substrate disposing surface of the heat treatment plate and sucking a space of the gap between the substrate disposing surface and the rear surface of the substrate, in which the substrate supported on the first disposing support member is sucked by the suction holes, such that the first disposing support member is contracted and the substrate is supported on the second disposing support member. |
