发明名称 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
摘要 <p>A semiconductor device has: a flat-shaped conductive portion on which a semiconductor element is disposed in a vertically superior portion and electrically connected; a casing wherein an edge portion of the conductive portion is engaged with an engaging portion provided on a lower portion of an inner wall, and wherein an upper portion of the inner wall surrounds the entire perimeter of the conductive portion; and a sealing material that covers the semiconductor element and the conductive portion from a vertically superior direction. The conductive portion and the casing are integrally formed, and a space shaped so as to engage with the edge portion of the conductive portion is provided on the lower portion of the inner wall of the casing as the engaging portion.</p>
申请公布号 WO2012046578(A1) 申请公布日期 2012.04.12
申请号 WO2011JP71620 申请日期 2011.09.22
申请人 NISSAN MOTOR CO., LTD.;TAKARAGI, SHINICHI;NAMIKI, KAZUSHIGE;ASAKURA, DAISUKE;NARUSE, MIKIO;MURAI, HIROAKI;FURUKAWA, MOTOYUKI 发明人 TAKARAGI, SHINICHI;NAMIKI, KAZUSHIGE;ASAKURA, DAISUKE;NARUSE, MIKIO;MURAI, HIROAKI;FURUKAWA, MOTOYUKI
分类号 H01L23/08;H01L23/02;H01L23/28;H01L25/07;H01L25/18 主分类号 H01L23/08
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