| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with improved mounting strength and heat dissipation at an external connection part. <P>SOLUTION: A lead frame 19 comprises a terminal lead 18, a frame body 4 surrounding the terminal lead 18, and a hanger lead 2 connecting the terminal lead 18 and the frame body 4. An external connection part 7 is provided on a side face, to which the hanger lead 2 is not connected, among side faces of the terminal lead 18. The semiconductor device comprises the terminal lead 18 formed by cutting the lead frame 19 at a position of the hanger lead 2, a semiconductor chip 12, and a resin 5. The external connection part 7 is not provided with the hanger lead 2, and therefore, a cutting surface is not formed on the external connection part 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
