发明名称 |
Sliding package retention device for LGA sockets |
摘要 |
A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms. |
申请公布号 |
US8151450(B2) |
申请公布日期 |
2012.04.10 |
申请号 |
US20080346997 |
申请日期 |
2008.12.31 |
申请人 |
CANHAM RICK;BANDORAWALLA TOZER;MCALLISTER ALAN;EAKINS KELLY;INTEL CORPORATION |
发明人 |
CANHAM RICK;BANDORAWALLA TOZER;MCALLISTER ALAN;EAKINS KELLY |
分类号 |
B23P19/00 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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