| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curing device of a liquid thermosetting resin which constantly maintains the horizontal curing position of the liquid thermosetting resin while improving the work efficiency and achieving the reduction of man hours or labor saving. <P>SOLUTION: A curing device heats and cures liquid thermosetting resin for sealing light emitting elements (LED chips) mounted on lead frames 20 in a heating furnace. The curing device includes a work stage 13 detachably supporting the lead frames 20 and chain guides 11 fixed to a chain 4 wound around multiple sprockets. The work stage 13 is supported on the chain guides 11 through a shaft 14 so as to rotate, and an angle adjusting brackets 16 are fastened to the shaft 14. A guide pin 17 protruding on each angle adjusting bracket 16 is engaged with a cam groove which is formed in a closed loop shape along the chain 4, and the cam groove is formed in a shape which allows the lead frames 20 supported by the work stage 13 to be maintained in horizontal positions. <P>COPYRIGHT: (C)2012,JPO&INPIT |
