| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interposer which prevents cracks and chips on a side surface of a semiconductor substrate, to provide a semiconductor device in which a chip is mounted on the interposer, and to provide manufacturing methods of the interposer and the semiconductor device. <P>SOLUTION: An interposer 10A comprises: a semiconductor substrate 11 having an upper surface on which a conductor circuit 19 is formed; and a protective layer 20A covering a side surface of the semiconductor substrate 11. The semiconductor substrate 11 is made of silicon. The upper surface of the semiconductor substrate is covered with a first insulation film 13 and a lower surface and a side surface are covered with the protective layer 20A. The semiconductor chips 1 and 2 are connected with electric wiring 19 (conductor circuit) of the interposer 10A by solder terminals 3 and 4 and fixed to the upper surface of the interposer 10A by the underfill 5 and 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
