| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor module. <P>SOLUTION: According to an embodiment, a semiconductor module includes a semiconductor element 11, a heat spreader 13 joined to the semiconductor element 11 through a solder 19, a bus bar 15 joined to the heat spreader 13 through the solder 19, and a protrusion part 17 having multiple protrusions provided at a space between the semiconductor element 11 and the heat spreader 13 and a space between the heat spreader 13 and the bus bar 15. The semiconductor element 11 and the heat spreader 13, and the heat spreader 13 and the bus bar 15 are respectively joined by the solder 19 with each part pressurized so as to come close to the counter part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
