发明名称 |
DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AND MOLD LOCKING APERTURE |
摘要 |
A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an“up-set”bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.
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申请公布号 |
US2012080781(A1) |
申请公布日期 |
2012.04.05 |
申请号 |
US201113324749 |
申请日期 |
2011.12.13 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
LI FELIX C.;LEE YEE KIM;LIM PENG SOON;YII TERH KUEN;LEE LEE HAN MENG@EUGENE |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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