| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, enabling high-density wiring even when interlayer insulation layers including non-penetration holes are integrally formed by screen printing. <P>SOLUTION: The multilayer printed wiring board is formed of interlayer insulation layers and wiring patterns alternately laminated at least on one face of a core substrate, with a blind via hole, formed in the interlayer insulation layers placed between the wiring patterns, for connecting upper- and lower-layer wiring patterns. The multilayer printed wiring board includes: the interlayer insulation layers formed by screen printing, at least having an inclined portion formed in a recess shape in the periphery of the opening side of a non-penetration hole for forming the blind via hole, and a round portion formed on the edge portion of the opening of the non-penetration hole; a non-penetration hole having an exposed wiring pattern obtained by removing a resin spread by the screen printing on the lower wiring pattern placed on the bottom of the non-penetration hole; and the wiring pattern and the blind via hole of metal plating formed on the interlayer insulation layer including the non-penetration hole having the exposed wiring pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT |
