SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL

摘要

The present disclosure describes a method of coating a substrate (110), the method including forming a layer (806) of sputtered material on the substrate (110). Forming the layer of sputtered material may include: sputtering material from at least one rotatable target (120') over the substrate (110); varying the relative position between the at least one target (120') and the substrate (110). In addition, the present disclosure describes varying the distance between a target (120; 120'; 120'') and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.