| 摘要 |
<p>A method for interleaving a module including the cutting out of the module on a strip, the gripping of the cut-out module, the conveying of the module right up to a station for affixing and adhesively bonding modules. The module being heated by a heater via heat conduction of an affixing system upon conveying and then affixing of the preheated module by positioning the head of a first guiding member on the upper portion of a second guiding member forming a mask showing the imprint of the module or chip, preformed on the card, by displacement of the affixing system and of positioning the lower portion of the second guiding member on the surface of the card by displacement of the assembly formed by the affixing system and the second guiding member. A device for interleaving a module is also described.</p> |
