发明名称 CIRCUIT APPARATUS AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A circuit device and a manufacturing method thereof are provided to prevent connection units from being shorted by connecting a circuit element with a bonding unit via the connection units. CONSTITUTION: An island unit is fixed to the upper side of a circuit board(12). A bonding unit(34) is separated from the upper side of the circuit board. A lead(18) has a lead unit(32) which is discharged to the outside. The circuit board is connected to the bonding unit. A circuit element is electrically connected to the bonding unit via a connection unit.
申请公布号 KR20120031455(A) 申请公布日期 2012.04.03
申请号 KR20110096148 申请日期 2011.09.23
申请人 ON SEMICONDUCTOR TRADING, LTD. 发明人 MASHIMO SHIGEAKI;HORIUCHI FUMIO;KUDO KIYOAKI;SAKURAI AKIRA;INAGAKI YUHKI
分类号 H05K3/28;H01L23/28;H05K1/16 主分类号 H05K3/28
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