| 摘要 |
PURPOSE: A heat processing method and apparatus for processing a semiconductor and a computer readable medium are provided to improve a processed amount by setting oxidation, nitridation, and anneal processes to be at the same temperature. CONSTITUTION: An exhaust outlet(6) is located on a ceiling part of a processing container(4). A manifold(16) is connected to an opening of a bottom part of the processing container through a seal member(20). A wafer boat(18) is ascended and descended through the opening of the bottom part of the manifold. A plurality of semiconductor wafers(W) is loaded into multiple stages in the wafer boat. A table(24) is supported on the top end part of a rotary shaft(28) passing through a cover(26). The rotary shaft is installed at a tip-end part of an arm(36) supported by an elevating mechanism(34).
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