| 摘要 |
The present invention relates to a cooling device, comprising: at least one cooling body (1) each of which is provided with a vacuum sealing chamber (3) therein; and a cooling medium filled in the vacuum sealing chamber (3), wherein the cooling medium has a high heat capacity. The cooling device according to the present invention can provide a high heat capacity, satisfactorily overcome thermal shock, and also has fine thermal conductivity and then can effectively cool devices such as an LED lighting apparatus. Another aspect of the present invention also relates to a cooling device, comprising: at least one cooling body (1), wherein the at least one cooling body comprises an elongated bendable member. The cooling device has fine thermal conductivity and heat dissipation property, and is lighter in weight and more flexible in design. In addition, the present invention also relates to an LED lighting apparatus comprising the above types of cooling devices. |
