发明名称 LASER PATTERNING APPARATUS AND LASER PATTERNING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser patterning apparatus capable of performing laser patterning on a thin film formed on a flexible substrate with a good yield and a laser patterning method thereof. <P>SOLUTION: A laser patterning apparatus includes a processing stage 30 that has a reference processing surface 33 on which the flexible substrate 1 having the thin film formed thereon is disposed, a wrinkle removing device 40 that is configured as a mechanism for stretching an outer periphery of a processing region of the flexible substrate 1 so that tension is applied outward in the width direction and forward and backward in the transporting direction, and a laser beam scanner means 20 that scans laser beam along a predetermined line while emitting the laser beam to the thin film formed on the flexible substrate 1. The thin film formed on the flexible substrate can be patterned by the laser patterning apparatus. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012061506(A) 申请公布日期 2012.03.29
申请号 JP20100208750 申请日期 2010.09.17
申请人 FUJI ELECTRIC CO LTD 发明人 TODA MASAAKI;SAWAYANAGI SATORU
分类号 B23K26/10;B23K26/00;B23K26/16;H01L31/04 主分类号 B23K26/10
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