发明名称 |
ELECTRICALLY CONDUCTIVE ADHESIVES |
摘要 |
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesives comprise at least one resin component, micron-sized electrically conductive particles having an average particle size of 2 µm to 50 µm, and from 0.01 to 15 wt.-% of sub-micron-sized electrically conductive particles having a average particle size of 300 nm to 900 nm. |
申请公布号 |
WO2012038373(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
WO2011EP66207 |
申请日期 |
2011.09.19 |
申请人 |
HENKEL AG & CO. KGAA;DREEZEN, GUNTHER;THEUNISSEN, LIESBETH;VAN DER BORGHT, CINDY |
发明人 |
DREEZEN, GUNTHER;THEUNISSEN, LIESBETH;VAN DER BORGHT, CINDY |
分类号 |
C09J9/02;C08K3/08;C09J11/04;H01R4/04 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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