| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure for improving heat dissipation when temperature is rising, in an electronic module formed by mounting an electronic module having an heating element mounted on a heat dissipating plate to a radiator. <P>SOLUTION: One surface of a radiator 2 is formed into a rugged shape composed of radiator side projecting parts 2a and radiator side recessed parts 2b, a receiving part 5 to support a heat dissipating plate 20 by making contact with one surface of the radiator 2 and the other surface of the heat dissipating plate 20 is interposed between both surfaces, the heat dissipating plate 20 is fastened to the radiator 2 through the receiving part 5, and the other surface of the heat dissipating plate 20 is formed into a rugged shape composed of heat dissipating plate side projecting parts 21 and heat dissipating side recessed parts 22. The radiator side projecting parts 2a get into the heat dissipating plate side recessed parts 22, and both projecting parts 2a and 21 are thereby brought into a mated state. As to linear expansion coefficients of those parts, the following magnitude relation is satisfied. The receiving part 5<the heat dissipating plate 20<the radiator 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
