发明名称 ELECTRONIC APPARATUS HEAT RADIATION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic apparatus heat radiation structure which conducts self-cooled heat radiation more efficiently. <P>SOLUTION: An electronic apparatus heat radiation structure includes: a heat receiving plate 3 to which multiple electronic apparatuses 7 and 8 are attached, radiators 4 in which heat pipes 1 having heat radiation fins 2 are provided at the heat receiving plate, and multiple housing containers 6, each of which has the radiator. The multiple electronic apparatuses are divided depending on their allowable temperature ranges and housed in different housing containers 6. The housing containers 6 housing the electronic apparatuses 7 of the high allowable temperature range are located at a higher position than the housing containers 6 housing the electronic apparatuses 8 of the low allowable temperature range. Further, the heat radiation fins 2 of the adjacent housing containers 6 are arranged so as not to be overlapped each other in the vertical direction in a plan view. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059940(A) 申请公布日期 2012.03.22
申请号 JP20100202018 申请日期 2010.09.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 IPPOSHI SHIGETOSHI;KATO KENJI
分类号 H05K7/20 主分类号 H05K7/20
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