发明名称 |
SUBSTRATE CARRYING MECHANISM, SUBSTRATE PROCESSING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>PURPOSE: A substrate transfer apparatus, a substrate processing apparatus, and a method for manufacturing a semiconductor device are provided to stably transfer a substrate at high speed by suppressing the degradation of a substrate maintaining force against deformation. CONSTITUTION: A transfer device transfers a substrate in a process chamber and includes a tweezer(32) and an arm. The tweezer supports the substrate. The arm moves the tweezer. The transfer device includes a planar unit and a substrate support unit(20). The substrate support unit is formed by arranging a plurality of convex parts on the surface of the planar unit on a smaller circumference than the diameter of the substrate.</p> |
申请公布号 |
KR20120028243(A) |
申请公布日期 |
2012.03.22 |
申请号 |
KR20110090894 |
申请日期 |
2011.09.07 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
TAKAHASHI AKIRA |
分类号 |
H01L21/677;B65G49/07 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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