发明名称 SUBSTRATE CARRYING MECHANISM, SUBSTRATE PROCESSING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 <p>PURPOSE: A substrate transfer apparatus, a substrate processing apparatus, and a method for manufacturing a semiconductor device are provided to stably transfer a substrate at high speed by suppressing the degradation of a substrate maintaining force against deformation. CONSTITUTION: A transfer device transfers a substrate in a process chamber and includes a tweezer(32) and an arm. The tweezer supports the substrate. The arm moves the tweezer. The transfer device includes a planar unit and a substrate support unit(20). The substrate support unit is formed by arranging a plurality of convex parts on the surface of the planar unit on a smaller circumference than the diameter of the substrate.</p>
申请公布号 KR20120028243(A) 申请公布日期 2012.03.22
申请号 KR20110090894 申请日期 2011.09.07
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 TAKAHASHI AKIRA
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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