发明名称 HEAT DISSIPATION SHEET
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible silicon heat dissipation sheet having a rigid core material and exhibiting excellent adhesion, heat conductivity and application workability to an electronic apparatus. <P>SOLUTION: The heat dissipation sheet has an adhesive heat dissipation composition layer formed by bonding a heat dissipation composition rigidly to both surfaces of a cloth core material. The heat dissipation composition consists of a silicon composition, a heat dissipation material and a hardening accelerator, the adhesive heat dissipation composition layer is in the form of gel and the core material is a Tulle fabric. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059811(A) 申请公布日期 2012.03.22
申请号 JP20100199747 申请日期 2010.09.07
申请人 MOCHIDA SHOKO KK 发明人 KOGA YOSHINORI;HATTORI TETSUYA;YOKOTA TATSUYA
分类号 H01L23/36 主分类号 H01L23/36
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