摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible silicon heat dissipation sheet having a rigid core material and exhibiting excellent adhesion, heat conductivity and application workability to an electronic apparatus. <P>SOLUTION: The heat dissipation sheet has an adhesive heat dissipation composition layer formed by bonding a heat dissipation composition rigidly to both surfaces of a cloth core material. The heat dissipation composition consists of a silicon composition, a heat dissipation material and a hardening accelerator, the adhesive heat dissipation composition layer is in the form of gel and the core material is a Tulle fabric. <P>COPYRIGHT: (C)2012,JPO&INPIT |