| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film for a semiconductor and a semiconductor device manufacturing method which can prevent chip flying during dicing and improve pickup property. <P>SOLUTION: A film 10 for a semiconductor is formed by lamination of an adhesion layer 3, a first adhesive layer 1 contacting the adhesion layer 3, and a second adhesive layer 2 contacting a face of the first adhesive layer 1 on the side opposite to the adhesion layer 3 and having adhesiveness higher than that of the first adhesive layer 1 in this order. Assuming that an average thickness of the first adhesive layer 1 is T1, a thickness of the second adhesive layer 2 is T2, T2 is 0.5-5 μm and T2/T1 is 0.001-0.65. <P>COPYRIGHT: (C)2012,JPO&INPIT |
