| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed-circuit board assembly method for improved mounting efficiency, relating to mounting of a bump component on a circuit board. <P>SOLUTION: A square chip 32 and a BGA36 which has a predetermined height or lower are assigned to an upper stream side mounting machine constituting a mounting line, and a low BGA is mounted on a circuit board first. The low BGA does not prevent mounting of a low square chip by a multi-nozzle head. The first mounting avoids the mounting of the low BGA on the low square chip which has dropped onto a non-mounting point of the low BGA, with no inspection of the mounting point. When, for example, a BGA36 whose height is higher than a set value is mounted by a lower stream side mounting device, it is inspected whether or not a low square chip has been dropped onto the point where a high BGA should be mounted, prior to mounting, if the square chip 32 has been mounted already. The inspection time required for that inspection is added to the mounting time required for operation itself for mounting the high BGA, which is taken as a required time that is required for mounting one high BGA. The total required time for the upper stream side mounting device and the lower stream side mounting device is to be constant. <P>COPYRIGHT: (C)2012,JPO&INPIT |
