| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a high-frequency circuit capable of reducing a high frequency signal loss. <P>SOLUTION: The package for a high-frequency circuit includes a signal line 31 formed on a dielectric substrate 10, first and second ground conductor layers 33 and 34 formed on both sides of the signal line 31, a frame-like dielectric layer 16 which overlaps with the signal line 31, and the first and second ground conductor layers 33 and 34, a third ground conductor layer 35 formed on the frame-like dielectric layer 16, a recess 29 formed on the first and second ground conductor layers 33 and 34 and the signal line 31, at the frame-like dielectric layer 16, first and second side surfaces 29b and 29c formed, laterally and diagonally against the length direction of the signal line 31 on the first and second ground conductor layers 33 and 34, in the recess 29, a first ground wiring 38a which is formed on the first side surface 29b of the recess 29 to electrically connect the first ground conductor layer 33 to the third ground conductor layer 35, and a second ground wiring 38b which is formed on the second side surface 29c of the recess 29 to electrically connect the second ground conductor layer 34 to the third ground conductor layer 35. <P>COPYRIGHT: (C)2012,JPO&INPIT |
