发明名称 PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS
摘要 <p>PURPOSE: A photoresist composition, a coated substrate including a layer based on the composition, and a method for forming a photo-lithography pattern using the same are provided to improve pattern collapse margin and to reduce the loss of thicknesses in the process of treating photo-lithography. CONSTITUTION: A photoresist composition includes a first unit, copolymer, and a photoacid generator. The first unit is formed based on monomer containing a polymeric functional group and a first part represented by chemical formula I or chemical formula II. The copolymer contains one or more additional unit without an acid cutting group which is capable of forming a carboxylic acid group by cutting. In chemical formula I or chemical formula II, the R1 and the R2 are respectively C1 to C10 linear, branched, cyclic organic groups or are arbitrarily capable of forming a ring; one of the a and the b is 1; another of the a and the b is 1 or 2; the R3 and the R4 are respectively C1 to C10 linear, branched, and cyclic organic groups or are arbitrarily capable of forming a ring; one of the c and the d is 1; and another of the c and the d is 1 or 2.</p>
申请公布号 KR20120026991(A) 申请公布日期 2012.03.20
申请号 KR20110091582 申请日期 2011.09.09
申请人 ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C.;DOW GLOBAL TECHNOLOGIES LLC 发明人 BAE YOUNG CHEOL;CARDOLACCIA THOMAS;SUN JIBIN;ARRIOLA DANIEL J.;FRAZIER KEVIN A.
分类号 G03F7/027;G03F7/004;G03F7/26 主分类号 G03F7/027
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