发明名称 |
Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof |
摘要 |
A semiconductor integrated circuit relating to one aspect of the present invention includes a power transistor, at least one or more of first metal patterns functioning as a first electrode of the power transistor and at least one or more of second metal patterns functioning as a second electrode of the power transistor formed in an interlayer insulation film on the transistor, at least one or more of first busses electrically connected to a corresponding first metal pattern of the at least one or more of the first metal patterns, a single second bus electrically connected to the at least one or more of second metal patterns, and a contact pad provided to each of the at least one or more of first busses and the single second bus.
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申请公布号 |
US8138615(B2) |
申请公布日期 |
2012.03.20 |
申请号 |
US20070946282 |
申请日期 |
2007.11.28 |
申请人 |
FUKAMIZU SHINGO;NABESHIMA YUTAKA;YAMAMOTO YASUNORI;PANASONIC CORPORATION |
发明人 |
FUKAMIZU SHINGO;NABESHIMA YUTAKA;YAMAMOTO YASUNORI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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