| 摘要 |
<p>There isprovidedan adhesive film for a semiconductor, comprising a thermoplastic resin (A), an epoxy resin (B) and a curing agent (C), wherein a minimum melt viscosity of said adhesive film for a semiconductor is 0.1 Pa·s to 500 Pa·s both inclusive in a temperature range of 50 °C to 180 °C both inclusive at a temperature-rise rate of 10 °C/min from room temperature and a content of volatile component is 5.0 % or less.</p> |
