| 摘要 |
A smart package (200), wherein the smart package comprises a module (100) for measuring acceleration applied to the smart package. The module (100) comprises preferably an acceleration sensor and a memory carrier, as well as a microcontroller for controlling operation of the acceleration sensor and for storing information produced thereby in said memory carrier. According to one embodiment, said acceleration sensor, memory carrier, and microcontroller are integrated into structures (201, 202) of said smart package (200). |
