发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME |
摘要 |
Provided are a semiconductor package and method of fabricating the same. The package includes an interconnection substrate, a semiconductor chip mounted on the interconnection substrate, a lateral wire bonded on the interconnection substrate and configured to enclose a side surface of the semiconductor chip, and a metal layer disposed on the semiconductor chip and electrically connected to the lateral wire.
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申请公布号 |
US2012061816(A1) |
申请公布日期 |
2012.03.15 |
申请号 |
US201113227940 |
申请日期 |
2011.09.08 |
申请人 |
SONG SANG-SUB;AN SANG-HO;OH JOON-YOUNG;KWAK DONG-OK;PARK JOON-KI;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG SANG-SUB;AN SANG-HO;OH JOON-YOUNG;KWAK DONG-OK;PARK JOON-KI |
分类号 |
H01L23/50;H01L23/52 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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