HEAT RESISTANT IC TAG

摘要

A heat resistant IC tag (1) of the present invention is configured such that a contactless type IC tag is housed and sealed airtightly within a first container (4) comprising glass material such as silica glass or borosilicate glass, which has impermeability against chemicals and heat resistance, and the first container (4) is further housed within a second container (6) comprising heat resistant resin. The most major characteristic of the heat resistant IC tag is in being configured such that the gap between the contactless type IC tag and the first container (4) is made vacuous, or at least a portion of the gap is filled with heat insulating material (5) comprising open cells.