发明名称 A SUBSTRATE TREATING APPARATUS
摘要 PURPOSE: A substrate processing apparatus is provided to change a process performed on a substrate for each substrate processing row, thereby suitably changing the process performed on the substrate for each substrate. CONSTITUTION: A supply part(34) comprises a plurality of nozzles(35), a grip part(36), and a nozzle transfer device(37). The nozzle transfer device transfers the nozzle between a standby position and a processing position of the upper side of a substrate(W). The nozzle transfer device comprises a first guide rail(37a) and a second guide rail(37b). One end of a processing liquid pipe(38) is connected to the nozzle. A heat treatment unit comprises a plate for mounting the substrate.
申请公布号 KR20120023840(A) 申请公布日期 2012.03.13
申请号 KR20120005203 申请日期 2012.01.17
申请人 SOKUDO CO., LTD. 发明人 OGURA HIROYUKI;MITSUHASHI TSUYOSHI;FUKUTOMI YOSHITERU;MORINISHI KENYA;KAWAMATSU YASUO;NAGASHIMA HIROMICHI
分类号 H01L21/027;G03F7/16;G03F7/30;H01L21/677 主分类号 H01L21/027
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