PCB ATTACHED TO TEST SOCKET OF SEMICONDUCTOR DEVICE AND TEST METHOD USING THE SAME

摘要

PURPOSE: A PCB(Printed Circuit Board) combined with the test socket of a semiconductor component and test method of the semiconductor component using the same are provided to effectively manufacture a PCB by bonding the PCB with a contact pin in a socket. CONSTITUTION: An upper PCB(200) is bonded with a first contact pin. The first contact pin is arranged at a location where is consistently separated from a contact pin(100). A lower PCB(210) is bonded with a second contact pin. The second contact pin is arranged at the location where is consistently separated from the first contact pin. The lower PCB is not boned with the first contact pin.